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1 / 17 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 1 4 ? 001 w ww.rohm.com 2.5v to 4.5v, 0.6a 1ch synchronous buck converter integrated fet bd9161fvm general description rohms high efficiency step - down switching regulator bd9161fvm is a power supply designed to produce 1.2volts (low voltage) fro m 3.3volts power supply line. offers high efficiency with our original pulse skip control technology and synchronous rectifier. employs a current mode control system to provide faster transient response to sudden change in load. features ? offers fast trans ient response with current mo de pwm control system. ? offers highly eff iciency for all load range with synchronous rectifier (nch/pch fet) ? incorporates 100% duty function. ? incorporates soft - start function. ? incorpora tes thermal protection and ulvo functions. ? incorporates short - current p rotection circuit with time delay function. ? i ncorporates shutdown function icc=0a (typ.) key specifications ? i nput voltage range: 2.5v to 4.5v ? o utput voltage range: 1.0v to 3.3v ? o utput current: 0.6a(max.) ? switching frequency: 1mhz (typ.) ? pch fet on resist ance: 0.35 (typ.) ? nch fet on resistance: 0.37 (typ.) ? s tandby current: 0a (typ.) ? operating temperature range : - 25 to +85 package msop8 : 2.9 0 mm x 4.0 0 mm x 0.83 mm applications power supply for hdd, dv d and for lsi of cpu, asic typical application circuit gnd,pgnd sw v cc ,pv cc en v out ith v cc v out cin rith cith l esr c o r o v out fig. 1 typical application circuit product structure silicon monolithic integrated circuit this product is not designed protection against radi oactive rays. datasheet
2 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pin configuration fig. 2 pin configuration pin description pin no. pin name pin function 1 adj output voltage feedback pin (adjustable) 2 ith gmamp output pin/connected phase compens ation capacitor 3 en enable pin (active high) 4 gnd ground 5 pgnd nch fet source pin 6 sw pch/nch fet drain output pin 7 pv cc pch fet source pin 8 v cc vcc power supply input pin block diagram (top view) v ref osc uvlo tsd current sense/ protect driver logic + soft start 8 7 6 5 4 2 1 3 r q s en v cc pv cc 3.3v input sw output pgnd gnd ith adj v cc slope current comp. gm amp. clk v cc scp fig. 3 block diagram
3 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 ) parameter symbol rating unit vcc voltage v cc - 0.3 to +7 *1 v pvcc voltage pv cc - 0.3 to +7 *1 v en voltage en - 0.3 to +7 v sw, ith voltage sw,ith - 0.3 to +7 v power dissipation 1 pd1 387.5 *2 mw power dissipation 2 pd2 587.4 *3 mw operating temperature range topr - 25 to +85 * 1 pd should not be exceeded. * 2 derating in done 3.1mw/ for temperatures above ta= 2 5 . * 3 derating in done 4.7mw/ for temperatures above ta=25 ,mounted on 70mm70mm1.6mm glass ep oxy pcb. operating ratings (ta=25 ) parameter symbol limits unit min. typ. max. vcc voltage v cc * 4 2.5 3.3 4.5 v pvcc voltage pv cc * 4 2.5 3.3 4.5 v en voltage en 0 - v cc v output voltage setting range sw,ith 1.0 - 3.3 v sw, ith average output curre nt isw * 4 - - 0.6 a * 4 pd should not be exceeded. electrical characteristics (ta=25 , v cc =pv cc =3.3v, en=v cc , unless otherwise specified. ) parameter symbol limits unit conditions min. typ. max. standby current i stb - 0 10 a cc - 200 400 a enl - gnd 0.8 v standby mode en high voltage v enh 2.0 v cc - v active mode en input current i en - 1 10 a en =3.3v oscillation frequency f osc 0.8 1 1.2 mhz pch fet on resistance r onp - 0.35 0.6 ? cc =3.3v nch fet on resistance r onn - 0.37 0.68 ? cc =3.3v output voltage v out 0.784 0.8 0.816 v ith si nk current i thsi 10 20 - a out =h ith s ource c urrent i thso 10 20 - a out =l uvlo threshold voltage v uvlo1 2.2 2.3 2.4 v v cc =hl uvlo2 2.22 2.35 2.5 v v cc =lh ss 0.5 1 2 ms timer latch time t latch 1 2 3 ms scp/tsd operated output short circuit threshold voltage v scp - 0.4 0.56 v v out =h
4 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves fig. 5 ven - vout fig. 4 vcc - vout fig. 6 iout - vout fig. 7 ta - v out
5 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 fig. 8 efficiency fig. 9 ta - fosc fig. 1 0 ta - v en fig. 1 1 ta - i cc
6 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 fig. 1 2 vcc - fosc fig.1 3 soft start waveform fig.1 4 sw waveform io=10ma fig.1 5 sw waveform io=500ma
7 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 fig. 1 6 sw waveform io=600ma fig. 1 7 transient response io=250 500ma(10s) 250ma(10s)
8 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 application information operation bd9161fvm is a synchronous r ectifying step - down switching regulator that achieves faster transient response by employing current mode pwm control system. it utilizes switching operation in pwm (pulse width modulation) mode for heavier load, while it utilizes sllm tm (simple light loa d mode) operation for lighter load to improve efficiency. current mode pwm control synthesizes a pwm control signal with a inductor current feedback loop added to the voltage feedback. ? pwm (pulse width modulation) control the oscillation frequency for pwm is 1 mhz. set signal form osc turns on a p - channel mos fet (while a n - channel mos fet is turned off), and an inductor current i l increases. the current comparator (current comp) receives two signals, a current feedback control signal (sense: voltage converted from i l ) and a voltage feedback control signal (fb ), and issues a reset signal if both input signals are identical to each other, and turns off the p - channel mos fet (while a n - channel mos fet is turned on) for the rest of the fixed period. the pwm control repeats this operation. ? sllm tm (simple light load mode) control when the control mode is shifted from pwm for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn off with the device held operated in normal pwm control loop, which allow s linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. although the pwm control loop continues to operate with a set signal from osc and a reset signal from curr ent comp, it is so designed that the reset signal is held issued if shifted to the light load mode, with which the switching is tuned off and the switching pulses are thinned out under control. activating the switching intermittently reduces the switching dissipation and improves the efficiency. ? 100% duty control max duty is 100%. (@ pch mos fet always on) in usual pwm control, in case output voltage cannot keep (ex, drop of input voltage), oscillation frequency becomes lower and finally it becomes 100% duty. the output voltage is a value that depends only by on a voltage hang from the input voltage to pch mos fet, and can keep the output voltage even with the low input voltage. fig. 19 diagram of current mode pwm control osc level shift driver logic r q s i l sw ith current comp gm amp. set reset fb load sense v out v out fig. 2 0 pwm switching timing chart fig. 2 1 sllm tm switching timing chart current comp set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb current comp set reset sw v out pvcc gnd gnd gnd 0a v out (ave) sense fb i l not switching i l
9 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 description of operations ? soft - start function en terminal shifted to high activates a soft - starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ? shutdown function with en terminal shifted to low, the device turns to standby mode, and all the function blocks including reference voltage circuit, internal oscillator a nd drivers are turned to off. circuit current during standby is 0f (typ.). ? uvlo function detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 50 mv (typ.) is provided to prevent output chattering. fig.2 2 soft start, shutdown, uvlo timing chart ? short - current protection circuit with time delay function turns off the output to protect the ic from breakdown when the incorporated current limiter is activated cont inuously for the fixed time (t latch ) or more. the output thus held tuned off may be recovered by restarting en or by re - unlocking uvlo. fig.2 3 short - current protection circuit with time delay timing chart hysteresis 50mv tss tss tss soft start standby mode operating mode standby mode operating mode standby mode operati ng mode standby mode uvlo en uvlo uvlo v cc en v out 1msec output off latch en v out limit i l standby mode operating mode standby mode operating mode en timer latch en
10 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 information on advantages advantage 1 offers fast transient response with current mode control system. voltage drop due to sudden change in load was reduced by about 50%. fig.2 4 comparison of transient response advantage 2 offers high efficiency for all load range. ? for lighter load: utilizes the current mode control mode called sllm tm for lighter load, which reduces various dissipation such as switching dissipation (p sw ), gate charge/discharge dissipation, esr dissipation of output capacitor (p esr ) and on - resistance dissipation (p ron ) that may otherwise cause degradation in efficiency for lighter load. achieves efficiency improvement for lighter load. ? for heavier load: utilizes the synchronous rectifying mode and the low on - resistance mos fets incorporated as power transistor. on resistance of p - channel mos fet: 0.35 ? (typ.) on resistance of n - channel mos fet: 0.37 ? (typ.) achieves efficiency improvement for heavier load. offers high efficiency for all load range with the improvements mentioned above. advantage 3 ? supplied in smaller package due to small - sized power mos fet incorporated. ? allows reduction in size of application products reduces a mounting area required. fig.2 6 example application ? tor co required for current mode control: 10 f ceramic capacitor ? inductance l required for the operating frequency of 1 mhz: 4.7 h inductor dc/dc convertor controller r ith l co v out c ith v cc cin 10mm 15mm r ith c ith c in c o l conventional product (vo ut of which is 2.5 volts) bd9161fvm (load response i o =250ma500ma) 0.001 0.01 0.1 1 0 50 100 pwm sllm tm inprovement by sllm tm system improvement by synchronous rectifier efficiency [%] output current io[a] fig.2 5 efficiency v out i out 98mv v out i out 40mv
11 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 switching regulator efficiency efficiency ? may be expressed by the equation shown below: efficiency may be improved by reducing the switching regulator power dissi pation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet pd(i 2 r) 2) gate charge/discharge dissipation pd(gate) 3) switching dissipation pd(sw) 4) esr dissipation of capacitor pd(esr) 5) operating current dissipa tion of ic pd(ic) 1)pd(i 2 r)=i out 2 (r coil+ r on ) (r coil [] dc resistance of inductor, r on [] on resistance of fet i out [a] output current.) 2)pd(gate)=cgsfv (cgs[f] gate capacitance of fet, f[h] switching frequency, v[v] gate driving voltage of fet) 4)pd(esr)=i rms 2 esr (i rms [a] ripple current of capacitor, esr[] equivalent series resistance.) 5)pd(ic)=vini cc (i cc [a] circuit current.) consideration on permissible dissipation and heat generation as this ic functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. if v cc =3.3v, v out =2.5v r onp =0.35?, r onn =0.37? i out =0.6a, for examp le, d=v out /v cc =2.5/3.3=0.758 r on =0.7580.35+(1 - 0.758)0.37 =0.2653+0.08954 =0.35484[?] p=0.6 2 0.35484 P 127.7[mv] as r onp is greater than r onn in this ic, the dissipation increases as the on duty becomes greater. with the consideration on the dissipatio n as above, thermal design must be carried out with sufficient margin allowed. = out i out viniin 100[%]= p out pin 100[%]= p out p out +p d 2 c rss i out f i drive 3)pd(sw)= (c rss [f] drive [a] 0 25 50 75 100 125 150 0 200 400 600 800 1000 85 387.5mw 587.4mw using an ic alone j - a=322.6 /w mounted on glass epoxy pcb j - a=212.8 /w powe r dissipation:pd [mw] ambient temperature:ta [ ] fig.2 7 thermal derating curve (msop8) p=i out 2 (r on ) r on =dr onp +(1 - d)r onn d out /v cc ) r onp onn out
12 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 selection of components externally connected 1. selection of inductor (l) * current exceeding the current rating of the inductor results in mag netic saturation of the inductor, which decreases efficiency. the inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. if v cc =3.3v, v out =2.5v, f=1mhz, i l =0.250.6a=0.15a * select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. 2. selection of output capacitor (co) inappropriate capacitance may cause problem in startup. a 10f to 100f ceramic capacitor is recommended. 3. selection of input capacitor (cin) a low esr 10f/10v ceramic capacitor is recommended to reduce esr dissip ation of input capacitor for better efficiency. the inductance significantly depends on output ripple current. as seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. i l = (v cc - v out )v out lv cc f [a] ??? i l =0.25i out max. [a] ??? cc - v out )v out i l v cc f [h] ??? (i l : output ripple current, and f: switching frequency) output capacitor should be selected with the consideration on the stability region and the equivalent serie s resistance required to smooth ripple voltage. output ripple voltage is determined by the equation (4) v out =i l esr [v] ??? (i l : output ripple current, esr: equivalent series resistance of output capacitor) *rating of the capacitor should be determined allowing sufficient margin against output voltage. less esr allows reduction in output ripple voltage. input capacitor to select must be a low esr capacitor of the capacitance sufficient to cope with high ripple cu rrent to prevent high transient voltage. the ripple current i rms is given by the equation (5): i rms =i out v out (v cc - v out ) v cc [a] ??? rms = i out 2 fig. 29 output capacitor (3.3 - 2.5)2.5 0.153.31m l R R 4.04 rms(max.) if v cc =3.3v, v out =2.5v, and i outmax.= 0.6a i rms =0.6 2.5(3.3 - 2.5 ) 5 =0.284[a rms ] i l fig.2 8 output ripple current i l v cc il l co vout v cc l co v out esr v cc l co v out cin
13 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4. determination of r ith , c ith that works as a phase compensator as the current mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter c onsisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min.) produced by the output capacitor and the load resistance with cr zero correction by the error amplifier. 5. determination of output voltage the output voltage v out is determined by the equation (6): v out =(r2/r1+1)v adj ??? (6) v adj : voltage at adj terminal (0.8v typ.) with r1 and r2 adjusted, the output voltage may be determined as required. (adjustable output voltage range 1.0v to 3.3v ) use 1 k? to 100 k? resistor for r1. if a resistor of the resistance higher than 100 k? is used, check the assembled set carefully for ripple voltage etc. fig.3 4 determination of output voltage gain [db] phase [deg] fig.3 1 open loop gain characteristics a 0 0 - 90 a 0 0 - 90 fz(amp.) fig.3 2 error amp phase compensation characteristics fp= 2r o c o 1 fz (esr) = 2e sr c o 1 pole at power amplifier when the output current decreases, the load resistance ro increases and the pole frequency lowers. fp (min.) = 2r omax. c o 1 [hz]with lighter load fp (max.) = 2r omin. c o 1 [hz]with h eavier load zero at power amplifier increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr reduces to half.) f z (amp.) = 2r ith. c ith 1 gnd,pgnd sw v cc ,pv cc en v out ith v cc v out cin r ith c ith l esr c o r o v out fig.3 3 typical application fz (amp.) = fp (min.) 2r ith c ith 1 = 2r omax. c o 1 fp(min.) fp(max.) fz(esr) i out min. i out max. gain [db] phase [deg] s w 6 1 adj l co r2 r1 output
14 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bd9161fvm cautions on pc board layout fig.3 5 board layout for the sections drawn with heavy line, use thick conducto r pattern as short as possible. lay out the input ceramic capacitor c in closer to the pins pv cc and pgnd, and the output capacitor co closer to the pin pgnd. lay out c ith and r ith between the pins ith and gnd as neat as possible with least necessary wiring . recommended component lists with above applications symbol part value manufacturer series l coil 4.7h tdk vlf5014at - 4r7m1r1 sumida cmd6d11b r in resistance 10? rohm mcr03 series c in ceramic capacitor 10f kyocera cm316x5r106k10a c o ceramic capacitor 10f kyocera cm316x5r106k10a c ith ceramic capacitor v out =1.0v 820pf murata grm18 series v out =1.2v 560pf murata grm18 series v out =1.5v 470pf murata grm18 series v out =1.8v 470pf murata grm18 series v out =2.5v 330pf murata grm18 series r ith resistance v out =1.0v 6.8k rohm mcr03 series v out =1.2v 8.2 rohm mcr03 series v out =1.5v 12k ro hm mcr03 series v out =1.8v 12k rohm mcr03 series v out =2.5v 15k rohm mcr03 series * the parts list presented above is an example of recommended parts. although the parts are sound, actual circuit characteristi cs should be checked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteristics should be conside red in establishing these margins. when switching noise is substantial and may impact the system, a low pass filter should be inserted between the vcc and pvcc pins, and a schottky barrier diode established between the sw and pgnd pins.
15 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 i/o equivalence circuit fig. 36 i/o equivalence circuit ? en pin ? sw pin pv cc sw pv cc pv cc ? adj pin ? ith pin en 10k adj 10k ith v cc
16 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. absolute maximum ratings while utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum rat ings including the voltage applied and the operating temperature range may result in breakage. if broken, short - mode or open - mode may not be identified. so if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it i s requested to take necessary safety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowest electrical potential in any operating conditions. 3. short - circuiting between terminals, and mis mounting when mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. failure to do so may result in ic breakdown. short - circuiting due to foreign matters entered between output terminals, or between output and power su pply or gnd may also cause breakdown. 4.operation in strong electromagnetic field be noted that using the ic in the strong electromagnetic radiation can cause operation failures. 5. thermal shutdown protection circuit thermal shutdown protection circuit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic. so, the ic the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally inte nded. 6. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impedance during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electrost atic protection, provide proper grounding to assembling processes with special care taken in handling and storage. when connecting to jigs in the inspection process, be sure to turn off the power supply before it is connected and removed. 7. input to ic terminals this is a monolithic ic with p + isolation between p - substrate and each element as illustrated below. this p - layer and the n - layer of each element form a p - n junction, and various parasitic element are formed. if a resistor is joined to a transi stor terminal as shown in fig 37 : p - n junction works as a parasitic diode if the following relationship is satisfied; gnd>terminal a (at resistor side), or gnd>terminal b (at transistor side); and if gnd>terminal b (at npn transistor side), a parasitic npn transistor is activated by n - layer of other element adjacent to the above - mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contrib uting to breakdown. it is therefore requested to take care not to use the device in such manner that the voltage lower than gnd (at p - substrate) may be applied to the input terminal, which may result in activation of parasitic elements. fig. 37 simplified struc ture of mono r isic ic 8. ground wiring pattern if small - signal gnd and large - current gnd are provided, it will be recommended to separate the large - current gnd pattern from the small - signal gnd pattern and establish a single ground at the r eference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of th e small - signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of exte rnal parts as well. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation vers ion of this document formal version takes priority
17 / 17 bd9161fvm data s heet 02.mar.2012 rev.001 www.rohm.com tsz02201 - 0j3j0aj00190 - 1 - 2 ? 2011 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ordering information b d 9 1 6 1 f v m - t r package f vm : m sop8 packaging and forming specification tr: embossed tape and reel physical dimension , tape and reel inf ormation marking diagram msop8(top view) d 9 1 part number marking lot number 1pin mark 6 1
datasheet d a t a s h e e t notice - rev.001 notice precaution for circuit design 1) the products are designed and produced for applicatio n in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremel y high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel contro llers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the rohm sales staff in advance. if product malfunctions may re sult in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard environment and not in any spec ial environments. a pplication of the products in a special environment can deteriorate product per formance. accordingly, verification and confirmation of product performance, prior to use, is recomm ended if used under the following conditions: [a] use in various types of liquid, includin g water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing componen ts, plastic cords, or other flammable items [f] use involving sealing or coating the prod ucts with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) verification and confirmation of performance characte ristics of products, after on- board mounting, is advised. 5) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 6) de-rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 7) confirm that operation temper ature is within the specified range described in product specification. 8) failure induced under deviant condition from what def ined in the product specific ation cannot be guaranteed. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the remainder of fl ux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance. regarding precaution for mounting / circu it board design, please specially refe r to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their const ants, and other types of information cont ained herein are applicable only when the products are used in accordance with standard methods . therefore, if mass production is intended, sufficient consideration to external conditions must be made.
datasheet d a t a s h e e t notice - rev.001 precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution during manufacturing and st oring so that voltage exceeding product ma ximum rating won't be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / so lder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriorate if the products are stored in the following places: [a] where the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] where the temperature or humidity exceeds those recommended by the company [c] storage in direct sunshine or condensation [d] storage in high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding recommended storage time period . 3) store / transport cartons in the correct direction, whic h is indicated on a carton as a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a dry bag. precaution for product label qr code printed on rohm product label is only for internal us e, and please do not use at cust omer site. it might contain a internal part number that is inconsistent with an product part number. precaution for disposition when disposing products please dispose them properly with a industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under controlled goods prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. prohibitions regarding industrial property 1) information and data on products, including application exam ples, contained in these specifications are simply for reference; the company does not guarantee any industrial pr operty rights, intellectual property rights, or any other rights of a third party regarding this information or data. ac cordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the us e of the products listed herein. 2) the company prohibits the purchaser of its products to exercise or use the in tellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products.

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